Description
Remove QFDs, PLCCs, SOICs and chip components without costly and complex equipment. Use ChipQuik® with your existing rework equipment or temperature controlled soldering irons. Special removal alloy has excellent wetting ability with a low melting temperature of 136°F (58°C). To use: apply paste flux to all leads with syringe; melt ChipQuik alloy on all pins of SMD; with wide iron tip; maintain alloy in a molten state long enough to release chip; lift chip from board with pick-up tool. Safe, affordable, easy and won't damage sensitive components. NoClean Paste Flux; 10cc syringe with tip.
Features
- Remove QFDs, PLCCs, SOICs and chip components without costly equipment
- Use with existing rework equipment or temp controlled soldering irons
- Special removal alloy has excellent wetting ability
- Low melting temperature
- Safe, affordable, easy and won't damage sensitive components
Disclaimer:
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